PR: SAMSUNG First Consumer 30nm‐class DDR3 DRAM Modules

Category: Memory | Posted on June 10, 2011

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Introduces First Consumer 30nm‐class Modules

Upgrades for Desktop and Notebook PCs Offer Speed, and Energy Savings

Ridgefield Park, NJ (June 9, 2011) – Samsung Electronics America, Inc., a market leader
and award‐winning innovator in digital consumer electronics and information
technology, today announced the introduction of 30‐nanometer‐class1
synchronous dynamic random‐access memory () modules for PC upgrades. This
new generation of faster, more energy efficient DRAM modules will be available
through consumer retail channels this summer.

“Replacing your DRAM can be one of the easiest, most cost‐effective ways to upgrade
your PC’s performance, and these new products offer the most energy‐efficient option
currently available to consumers,” said Reid Sullivan, senior vice president of mobile
entertainment marketing, Samsung Electronics America. “Samsung is committed to
bringing performance‐enhanced computing to consumers, and our 30nm‐class process
technology offers an outstanding combination of advanced low‐power DDR3
technology, with blazing speed up to 1,600 megabits per second (Mbps).”

Samsung’s new DDR3 DRAM modules are available in 2 and 4 gigabyte capacities, in
(VLP) unbuffered dual in‐line memory module (UDIMM) configurations
for desktop PCs, and small outline DIMM (SODIMM) configurations for notebook PCs.
Backwards compatible with systems designed for previous DDR3 and DDR2 memory,2
the modules are available in single or dual‐pack quantities.

Thanks to its leading‐edge 30nm‐class manufacturing technology – which achieves
higher memory capacity while using less power – the latest generation of Samsung’s
DDR3 DRAM modules use up to two‐thirds less energy than those manufactured with
the industry‐standard 60nm‐class technology. This improvement in energy efficiency
does not come at the expense of performance. The new modules transfer data at up to
1,600 Mbps, 20 percent faster than Samsung’s current 40nm‐class generation of DDR3
DRAM.

Samsung has been leading the advancement of DRAM technology since it developed the
industry’s first DDR DRAM in 1997. In 2001, it introduced the first DDR2 DRAM. In 2005,
it announced the first DDR3 DRAM using 80nm‐class technology, and in January 2011, it
announced the development of the industry’s first DDR4 DRAM modules.

Availability
Samsung’s new 30nm‐class DDR3 DRAM modules will be available in the U.S. through
numerous online and retail suppliers, including Amazon, Fry’s, Micro Center, Newegg
and TigerDirect. Estimated street prices for single pack modules will range from less
than $30 to less than $55; dual pack modules will range from less than $55 to less than
$110.

About Samsung Electronics America, Inc. Samsung Electronics America, Inc. (SEA),
based in Ridgefield Park, N.J., is a subsidiary of Samsung Electronics Co., Ltd. The
company markets a broad range of award‐winning consumer electronics, information
systems, and home appliance products, as well as oversees all of Samsung’s North
American operations including Samsung Telecommunications America, LP, Samsung
Semiconductor Inc., Samsung Electronics Canada, Inc. and Samsung Electronics Mexico,
Inc. As a result of its commitment to innovation and unique design, the Samsung
organization is one of the most decorated brands in the electronics industry.

For more information, please visit www.samsung.com. You can also Fan Samsung on
www.Facebook.com/SamsungUSA or follow Samsung via Twitter @SamsungTweets.

1
30nm‐class means a process technology node somewhere between 30 and 39 nanometers.
2
Check with your PC manufacturer to assure compatibility.



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