Broadcom executives at MWC confirmed nowadays that the chipmaker is “beyond the sampling phase and even in a preproduction phase,” according to Michael Hurlston, the company’s senior vice president for wireless LAN, for its two-stream and three-stream 11ac chips. 11ac like 11n uses multiple data streams paired with multiple sending and receiving antennas to accomplish lofty data throughput.

Hurlston said he expects all-embracing OEM products, nearly absolutely access points, routers and the like, to be on sale from Broadcom’s customers by mid-2012. Although the chipmaker hasn’t announced method wins, Hurlston pointed out that the 11ac roadmap announced last month at CES was publicly endorsed by 14 equipment vendors and network providers.

In the booth, Broadcom was running one-, two- and three-stream 11ac radios. The single-stream radio, the type that would be integrated into a smartphone, was delivering usable throughput ranging between 300Mbps and 370Mbps (compared to the underlying PHY rate of 450Mbps), orders of magnitude greater than the 30Mbps-50Mbps, or slightly more, that single-stream 11n can deliver for phones today.

There is a widespread expectation that the additional premium that equipment makers and ultimately end users will have to pay for this improvement is comparatively low. Hurlston estimated that the premium for its 11ac products will be stray from 1.2 to 1.5 times initially. “We exceeded our expectations for that [i.e., for keeping it low],” he said. If the takeup is as fast as many expect, that will rapidly decline.

The three-stream products from Broadcom and rivals like Qualcomm and Atheros will hold throughput of just above 1 gigabit initially.

Qualcomm, with the Wi-Fi expertise and technology from its Atheros acquisition, confirmed it will kick off sampling its 11ac product family sometime in 2012 Q2, according to David Favreau, vice president of product management.

A lot of Qualcomm’s development effort has also involved creating integrated communications processors, marrying Wi-Fi with Bluetooth and other radios, and then tying the effect closely to its Snapdragon applications processor, which powers a wide stray of smartphones today.

Qualcomm’s booth here showed its single-stream 11ac radio, mounted in smartphone prototypes, running in the 220Mbps range, peaking at one point to 247Mbps, in a surrounding Wi-Fi environment, interior MWC’s cavernous Hall 8, that Favreau described as “challenging.”

It’s also a great time to build an Intel-based computer. The successor to LGA 1155 (the Sandy Bridge socket), LGA 2011, is not due out until late this year, and looks to supersede LGA 1366 at Intel’s highest-end of the desktop CPU spectrum. Other than supporting Sandy Bridge-E CPUs, LGA 2011 will offer PCIe 3 (which current GPUs can’t take advantage of) and native USB 3.0 (even though third-party USB 3.0 controllers are already shipping on many Intel and AMD motherboards). Considering how capable the Core i5-2500K and Core i7-2600K are today, it’s unlikely Sandy Bridge-E will field any model that’s astonishingly faster than what’s already available. Thus, if you buy a Core i7-2600K now, you’ll be at the near pinnacle of desktop computing for at least 5-6 months. I think there are times to buy and times to wait. It’s a bad idea to buy right before a lineup refresh (as is the case with AMD today), but it’s also unwise to delay building a system to hold out for the next big thing when that’s half a year away and unlikely to be that much better!

Introducing the Danshui Bay concept:

Simply put, ASUS are wanting to combine two chipsets on one motherboard – the X58 socket 1366, and the X79 socket 2011.  If we completely disregard the technical challenges this faces, it provides the interesting idea of something that might be possible in the future:  You want to upgrade your machine to the latest chipset and processor.  Rather than throw your old processor away or sell it on, you could buy a motherboard that lets you harness the power of the old processor and a new processor together, in some form of chimerism.

As for the technical challenges in producing such a product, I could reel off a whole list.  For a start, chipsets are not designed to talk to each other.  Processors need dual QPI links to talk to each other of the same model – how that would work with different socket processors with different caches and core counts is also a mystery, as with 1366 you would need an appropriate Xeon.  With two chipsets, you’ll have to have a different set of memory for each processor, and possibly getting a mismatch there based on dual/tri/quad channel memory.  Each processor requires its power and a set of PCIe each – unless you disregard the PCIe of one of the chipsets but then you would have to have at least the processor of the other socket in order to run a discrete GPU.  The same goes with SATA ports, I/O connectors, USB headers, and so on.

Obviously, this board presented is a mockup – merely bits and pieces put together.  It’s showing sixteen SATA 3 Gbps and six SATA 6 Gbps for a start, as well as no significant power delivery and an obscene form factor.  ASUS only want to know that if there was a demand for such a product, despite the technical limitations.

MSI’s Z68A-GD80 (G3) features new circuitry and switches between the CPU socket and the x16 slots that will apparently allow the motherboard to operate at PCIe Gen 3 speeds. The problem seems confined to the switches that motherboard makers use to automatically divide the 16 PCIe lanes coming from the CPU into 1 x16 or 2 x8. MSI claims that when Ivy Bridge comes out, the Z68A-GD80 (G3) will be fully PCIe Gen 3 compliant.

Of course MSI had a Socket-2011 X79 motherboard on display in addition to a pair of Socket-FM1 Llano boards. I’m hearing late summer for the desktop Llano launch at this point.

Those of you waiting for Bulldozer performance results from Computex, I’m afraid we’re not going to see anything representative of final hardware. I did hear that the upcoming B2 stepping would restore performance to Bulldozer’s original targets, however it’s unclear how those compare to Sandy Bridge. The other thing I did hear at the show floor regarding Bulldozer was about its clock speed. Current B1 stepping parts are easily hitting 3.8GHz which is what the high end SKU may actually ship at (with turbo support up to 4.2GHz). I’m waiting for more confirmation but it sounds like Bulldozer will at least clock very high.

Intel had a number of Sandy Bridge motherboards on display that conform to the Thin Mini-ITX standard. Most of the boards use Intel’s H61 chipset.

The cooling system is also standardized. Below is an example of the cooling solution Intel will be selling in Q4 of this year:

Intel also had a number of all-in-one cases available. While most weren’t all that elegant looking, this model from Loop looked very Apple-like:

There were a number of DC power adapters on display, ranging from 150W to 180W. The power connector is also a standard.

Going forward as the majority of desktops move to even lower TDPs, these DIY all-in-one systems may end up becoming more popular. One major issue I see right away is the lack of support for discrete graphics. Go far enough into the future and perhaps that won’t be so important, but today it’s not fun driving a high resolution panel off of SNB integrated graphics. I do hope that as Intel pushes for this standard it doesn’t forget that discrete GPUs are still quite necessary for many users in 2011. Maybe we’ll eventually get that upgradable 27-inch iMac that I was asking for recently.